{"title":"Effect of Post-Gate Deposition Annealing on the Electrical Characteristics of AlGaN/GaN HEMTs with p-GaN Gate","authors":"S. Kawabata, J. Asubar, H. Tokuda, M. Kuzuhara","doi":"10.1109/IMFEDK.2018.8581948","DOIUrl":null,"url":null,"abstract":"Aiming towards fail-safe normally-off operation we have fabricated AlGaN/GaN HEMTs with p-GaN gate. From device transfer characteristics, we have confirmed that threshold voltage (Vth) was shifted towards the positive direction with increasing p-GaN layer thickness and this amount of shift was further enhanced by post-gate deposition annealing.","PeriodicalId":434417,"journal":{"name":"2018 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMFEDK.2018.8581948","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Aiming towards fail-safe normally-off operation we have fabricated AlGaN/GaN HEMTs with p-GaN gate. From device transfer characteristics, we have confirmed that threshold voltage (Vth) was shifted towards the positive direction with increasing p-GaN layer thickness and this amount of shift was further enhanced by post-gate deposition annealing.