Effect of Post-Gate Deposition Annealing on the Electrical Characteristics of AlGaN/GaN HEMTs with p-GaN Gate

S. Kawabata, J. Asubar, H. Tokuda, M. Kuzuhara
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Abstract

Aiming towards fail-safe normally-off operation we have fabricated AlGaN/GaN HEMTs with p-GaN gate. From device transfer characteristics, we have confirmed that threshold voltage (Vth) was shifted towards the positive direction with increasing p-GaN layer thickness and this amount of shift was further enhanced by post-gate deposition annealing.
栅极后沉积退火对p-GaN栅极AlGaN/GaN hemt电学特性的影响
为了实现故障安全的正常关闭操作,我们制造了带有p-GaN栅极的AlGaN/GaN hemt。从器件转移特性来看,我们已经证实阈值电压(Vth)随着p-GaN层厚度的增加而向正方向偏移,并且栅极后沉积退火进一步增强了这种偏移量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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