Accurate 3D modelling and simulation of advanced packages and vertical stacked dice

Abstract

In previous papers, the authors have investigated planar configurations existing in high-density interconnection (HDI) structures from the electromagnetic and signal integrity viewpoints (using 2.5D field solvers), offering solutions to signal integrity (SI) and electromagnetic compatibility (EMC) concerns . This paper presents new investigations and results focused on 3D modelling and simulation of advanced packages (SIP- system in package, SOP - system on package) and vertical stacked dice. A system-in-a-package or system in package, also known as a chip stack MCM, has a number of integrated circuits enclosed in a single package or module. The SIP performs all or most of the functions of an electronic system. System-on-package (SOP) is the new emerging system technology that goes beyond system-on-chip (SOC) and system-in-package (SIP) and forms the basis of all emerging digital convergent electronic and bio-electronic systems.