Circuit hot carrier reliability simulation in advanced CMOS process technology development

P. Fang, P.C. Li, J. Yue
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引用次数: 2

Abstract

To establish the relation between circuit AC hot carrier (HC) degradation and DC testable parameters in early development stage of a deep submicron technology becomes the critical part of the process integration. DC Hot Carrier parameters, e.g. Idsat and Idlin, were found to be correlated to AC Ring Oscillator frequency degradation. The impact of crosstalk induced voltage overshoot to invertor hot carrier degradation was quantified by simulation. A set of designable parameters were used to ensure deep submicron technology hot carrier reliability.
电路热载流子可靠性仿真在先进CMOS工艺技术发展中的应用
在深亚微米技术开发初期建立电路交流热载子(HC)降解与直流可测参数之间的关系成为工艺集成的关键环节。直流热载波参数,如Idsat和Idlin,被发现与交流环振荡器频率退化相关。通过仿真量化了串扰诱发电压超调对逆变器热载流子退化的影响。采用一组可设计参数来保证深亚微米技术热载流子的可靠性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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