Antenna array integrated on multilayer organic package for millimeter-wave applications

Cheng-Yu Ho, Ming-Fong Jhong, Po-Chih Pan, Chen-Chao Wang, Chun-Yen Ting, Ken-Huang, L. Hsueh, Shang-Hao Liu, Hung-chia Chang
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引用次数: 6

Abstract

A high-directivity microstrip-fed Yagi-Uda antenna has been developed for millimeter-wave applications. This work proposed antenna is built on a low-cost and low-loss multilayer organic substrate for flip chip ball grid array (FCBGA) package. The proposed antenna achieves both broadband and high gain characteristics, which meets the requirement of IEEE 802.1 lad standard. The four-element Yagi-Uda array is also implemented to low-cost and low-loss multilayer organic substrate. The four-element design results in a peak gain of 12–14.5 dBi at operating frequency band. The proposed antenna shows excellent performance in free space and is suitable for millimeter-wave application, such as smart phone, laptops, and wireless router for point-to-point communication systems.
集成在多层有机封装上的毫米波天线阵列
研制了一种用于毫米波应用的高指向性微带馈电Yagi-Uda天线。本研究提出一种低成本、低损耗的多层有机基板天线,用于倒装球栅阵列封装。该天线同时具有宽带和高增益特性,满足IEEE 802.1 lad标准的要求。四元Yagi-Uda阵列也实现在低成本、低损耗的多层有机衬底上。在工作频段,四元件设计的峰值增益为12-14.5 dBi。该天线在自由空间表现出优异的性能,适用于毫米波应用,如智能手机、笔记本电脑和点对点通信系统的无线路由器。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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