Tackling low temperature bonding in fine pitch applications

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2017-05-01 DOI:10.23919/LTB-3D.2017.7947437

H. Oppermann, K. Lang

引用次数: 0

Abstract

Fine pitch flip chip applications and small sealing ring structures are demanding for metal interconnects. Thermocompression bonding requires higher temperature. Examples are shown how to reduce bonding temperatures in different applications.

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解决低温粘接在小间距应用

细间距倒装芯片应用和小密封环结构对金属互连有很高的要求。热压键合需要更高的温度。举例说明了如何在不同的应用中降低键合温度。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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