Crosstalk and Gate Oxide Reliability Analysis in Graphene Nanoribbon Interconnects

Debaprasad Das, H. Rahaman
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引用次数: 44

Abstract

We present the effects of cross talk in graphene nanoribbon (GNR) interconnects for 16 nm technology node. This is the first time that the cross talk analysis is presented in GNR interconnects. The electrical equivalent model is used to derive the electrical circuit parameters for GNR interconnects and cross talk analysis is performed for noise, and overshoot/undershoot analysis. The results are compared with that of copper (Cu) and multi-wall carbon nanotube (MWCNT) based interconnects. The near-end cross talk noise and overshoot/undershoot are greater in GNR as compared to that of Cu and MWCNT based interconnects, whereas the far-end noise and overshoot/undershoot in GNR are smaller as compared to Cu and greater as compared to that of MWCNT based interconnects. The impact of overshoot/undershoot on the gate oxide of MOS devices has been investigated and it is found that GNR based interconnect has two orders of magnitude less failure-in-time rate than Cu interconnects.
石墨烯纳米带互连中的串扰和栅氧化可靠性分析
研究了16纳米节点石墨烯纳米带(GNR)互连中的串扰效应。这是第一次在GNR互连中提出串扰分析。利用等效电学模型推导了GNR互连电路参数,并对噪声进行串扰分析和过调/欠调分析。结果与铜(Cu)和多壁碳纳米管(MWCNT)互连的结果进行了比较。GNR的近端串扰噪声和过调/欠调比Cu和MWCNT的互连大,而GNR的远端噪声和过调/欠调比Cu小,比MWCNT的互连大。研究了超调/欠调对MOS器件栅极氧化物的影响,发现基于GNR的互连比基于Cu的互连的失败率低两个数量级。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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