A study of the influence of electron beam on electrical characteristics of LOCOS device

H. Lin, C. H. Chao
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引用次数: 0

Abstract

Electrical characteristic changes in scaled MOSFET devices have been widely reported due to electron beam (EB) irradiation. For local oxidation of silicon (LOCOS) devices, the effects of EB-induced damage when performing measurements using an SEM based nanoproer, however, have rarely been reported. EB penetration into the dielectrics, resulting in the modification of the physical properties of the dielectric layer, could be a concern, not only for scaled devices, but also for LOCOS devices. This study reveals that the effect of EB on LOCOS devices can be measured using a scanning electron microscope (SEM) based nanoprober with inducing electrical characteristic changes. These changes are accounted for by the hole trapping at the birdsbeak, which has a significant effect on both the junction electrical characteristics and punchthrough characteristics in LOCOS isolation structures when an SEM is employed for probe guidance. Further, some preliminary experimental results, not included in this paper, show that lowering the EB acceleration voltage is found to not be able to significantly eliminate the effects of EB-induced damage during device inspections in failure analysis procedures. More advanced studies are currently under investigation.
电子束对LOCOS器件电气特性影响的研究
电子束辐照引起的MOSFET器件的电特性变化已被广泛报道。然而,对于硅的局部氧化(LOCOS)器件,在使用基于扫描电镜的纳米探针进行测量时,eb引起的损伤的影响很少被报道。EB渗透到介电体中,导致介电层物理性质的改变,不仅对于缩放器件,而且对于LOCOS器件,都可能是一个问题。本研究表明,利用扫描电子显微镜(SEM)纳米探针,通过诱导电特性变化,可以测量EB对LOCOS器件的影响。这些变化是由鸟喙处的孔捕获引起的,当使用扫描电镜进行探针引导时,孔捕获对LOCOS隔离结构的结电特性和穿透特性都有显著影响。此外,本文未包括的一些初步实验结果表明,在失效分析过程中,降低EB加速电压并不能显著消除设备检查中EB引起的损伤的影响。目前正在进行更深入的研究。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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