Extracting Resistances of Carbon Nanostructures in Vias

Abstract

This paper describes a current-sensing technique to extract the resistances of carbon nanostructures in via interconnects. Test structures designed and fabricated for via applications contain carbon nanofiber (CNF)-metal composites embedded in silicon dioxide (SiO2). Electrical characterization of single CNFs is performed using an atomic force microscope (AFM). This technique yields a metal-CNF contact resistance of 6.4 k¿ and a lowest CNF resistivity of 1.89e-4 ¿-cm.