Multiple cell upsets tolerant content-addressable memory

Syed Mohsin Abbas, S. Baeg, Sungju Park
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引用次数: 6

Abstract

Multiple cell upsets (MCUs) become more and more problematic as the size of technology reaches or goes below 65 nm. The percentage of MCUs is reported significantly larger than that of single cell upsets (SCUs) in 20nm technology. In SRAM and DRAM, MCUs are tackled by incorporating single-error correcting double-error detecting (SEC-DED) code and interleaved data columns. However, in content-addressable memory (CAM), column interleaving is not practically possible. It has been previously proposed that Hamming distance based approaches are good for SCUs but are not effective for MCUs. These schemes require a large number of extra parity bits for mitigating MCUs, and so they are not a practical solution for CAM devices. A novel error correction code (ECC) scheme is proposed in this paper that will cater for ever-increasing MCUs. This work demonstrated that m parity bits are sufficient to cater for up to m-bit MCUs, with an understanding of the physical grouping of MCUs. The results showed that the proposed scheme requires 85% fewer parity bits compared to traditional Hamming distance based schemes
多单元扰乱容忍内容可寻址内存
随着技术尺寸达到或低于65纳米,多单元干扰(mcu)变得越来越成问题。据报道,在20nm技术中,mcu的百分比明显大于单细胞扰流(scu)。在SRAM和DRAM中,mcu通过合并单错误校正双错误检测(SEC-DED)代码和交错数据列来解决。然而,在内容可寻址内存(CAM)中,列交错实际上是不可能的。以前已经提出,基于汉明距离的方法对scu很好,但对mcu无效。这些方案需要大量额外的奇偶校验位来缓解mcu,因此它们不是CAM设备的实用解决方案。本文提出了一种新的纠错码(ECC)方案,以满足日益增长的mcu需求。这项工作表明,m奇偶校验位足以满足高达m位的mcu,并了解mcu的物理分组。结果表明,与传统的基于汉明距离的方案相比,该方案所需的校验位减少了85%
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