Power supply wires self-heating analysis

Abstract

Self-heating is one of the major problems of high performance ICs due to scaled feature sizes, interconnect congestion and increased current densities. As a consequence, particular attention is necessary to avoid reliability drawbacks. In this paper we report analysis results achieved evaluating self-heating of power supply busses in presence of current injection related to different working conditions. This set of estimations has been realized considering three distinct metal layers and two logic families. This analysis and optimization methodology and results will be inserted in a developing tool for power supply noise evaluation and reduction, with the aim to take into account thermal phenomena while optimizing power bus sizing and routing for noise avoidance.