{"title":"R&D of 3D-IC Technology through National Projects","authors":"K. Kikuchi","doi":"10.1109/IMFEDK56875.2022.9975437","DOIUrl":null,"url":null,"abstract":"Three-dimensional integrated circuit (3D-IC) technology is one of the most important integration technologies for developing the new generation of electronic devices. We reveal the research and development of 3D-IC technology contributing to the future era of AI, IoT, and big data through national projects.","PeriodicalId":162017,"journal":{"name":"2022 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-11-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMFEDK56875.2022.9975437","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Three-dimensional integrated circuit (3D-IC) technology is one of the most important integration technologies for developing the new generation of electronic devices. We reveal the research and development of 3D-IC technology contributing to the future era of AI, IoT, and big data through national projects.