Y. Tanabe, Y. Nakatsuka, S. Sakai, T. Miyazaki, T. Nagahama
{"title":"Diluted wet oxidation: a novel technique for ultra thin gate oxide formation","authors":"Y. Tanabe, Y. Nakatsuka, S. Sakai, T. Miyazaki, T. Nagahama","doi":"10.1109/ISSM.1997.664621","DOIUrl":null,"url":null,"abstract":"An ultra-pure water vapor generator that is compatible with RTP wet oxidation has been developed to meet the need for high quality gate oxides in deep sub-micron device process. This generator is based on a catalytic surface reaction of hydrogen gas and oxygen gas, and enables a precise control of H/sub 2/O/O/sub 2/ ratio in the processing gas at any desired percentage. Diluted Wet Oxidation (DWO) utilizes a low H/sub 2/O/O/sub 2/ ratio precisely controlled by the water vapor generator to obtain a low oxidation rate comparable to dry oxidation, which results in an accurate film thickness while maintaining the film characteristics of wet oxidation.","PeriodicalId":138267,"journal":{"name":"1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSM.1997.664621","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
An ultra-pure water vapor generator that is compatible with RTP wet oxidation has been developed to meet the need for high quality gate oxides in deep sub-micron device process. This generator is based on a catalytic surface reaction of hydrogen gas and oxygen gas, and enables a precise control of H/sub 2/O/O/sub 2/ ratio in the processing gas at any desired percentage. Diluted Wet Oxidation (DWO) utilizes a low H/sub 2/O/O/sub 2/ ratio precisely controlled by the water vapor generator to obtain a low oxidation rate comparable to dry oxidation, which results in an accurate film thickness while maintaining the film characteristics of wet oxidation.