Design automation of power integrated circuits in EDGE environment

L. Hébrard, G. Jacquemod, B. Boutherin, M. Le Helley
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引用次数: 2

Abstract

Presents SETIPIC, a software package to forecast the electrothermal interactions in the first design steps of power integrated circuits. To give a well-consistent interface with graphic tools to the designer, SETIPIC works under the EDGE CAD system. The software aspect of this integration into EDGE is explained. PICMOST, the thermal simulator used by SETIPIC to obtain the thermal distribution on the layout surface in a transient or stationary mode is also described. In particular, the method to take into account the chip environment (package...) with an automatic mesh to handle aleatory layout configurations is explained. Finally, some thermal simulation results are given.<>
EDGE环境下电源集成电路的自动化设计
介绍了用于预测功率集成电路设计初期电热相互作用的软件SETIPIC。为了给设计师提供一个与图形工具一致的界面,SETIPIC在EDGE CAD系统下工作。本文解释了这种集成到EDGE中的软件方面。本文还介绍了settipic所使用的热模拟器PICMOST,该热模拟器可以获得布局表面在瞬态或稳态模式下的热分布。特别说明了考虑芯片环境(封装…)的自动网格处理任意布局配置的方法。最后给出了一些热模拟结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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