Fabrication of freestanding thin Pt/W thermocouple by Joule heat welding

H. Tohmyoh, H. Takeda, M. Khan, M. Saka
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引用次数: 2

Abstract

A very-thin Pt/W thermoelectric element is fabricated on a small chip. The Pt and W thin wires having the diameter of 5 µm are attached on a Cu electrode chip, and these are electrically isolated by air grove on the chip. The tips of both thin wires are welded by the technique of Joule heating. The other ends of wires are connected to a voltmeter. Temperature of the constructed electro-thermal circuit is controlled by flowing of the current through the circuit. The observed voltage is found to be proportional to the temperature difference between the dissimilar welding point and the chip (room temperature) which satisfies the Seebeck effect. The Seebeck coefficient is found to be about 0.2 µV/K. The temperature distribution of 5 µm Pt wire, where the constant current is flowing, is successfully measured by the fabricated very-thin Pt/W thermoelectric element.
焦耳热焊制备独立薄型Pt/W热电偶
一个非常薄的铂/钨热电元件被制造在一个小芯片上。将直径为5µm的Pt和W细导线连接在Cu电极芯片上,通过芯片上的空气凹槽进行电隔离。两根细导线的尖端采用焦耳加热技术焊接。导线的另一端连接到电压表上。所构建的电热电路的温度由流过电路的电流来控制。观察到的电压与不同焊点与芯片之间的温差(室温)成正比,满足塞贝克效应。塞贝克系数约为0.2µV/K。利用自制的极薄Pt/W热电元件,成功测量了恒流流过5µm Pt导线的温度分布。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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