Design optimization for electrical performance of a LFBGA package using EM-field simulation

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Pub Date : 2012-12-01 DOI:10.1109/EPTC.2012.6507188

C. Hunat, Carolyn Tubulo, Chuen Khiang Wang, R. Liang, N. Suthiwongsunthorn

引用次数: 0

Abstract

In this paper we presented methods of optimizing a 17×17mm LFBGA package having improve its electrical performance using an electromagnetic-field software through simulation, particularly on controlled signals (single-end & differential pairs) and high-speed I/O signal traces.

查看原文本刊更多论文

利用电磁场仿真对LFBGA封装的电气性能进行优化设计

在本文中，我们提出了优化17×17mm LFBGA封装的方法，利用电磁场软件通过仿真提高了其电气性能，特别是在受控信号(单端和差分对)和高速I/O信号走线上。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)

自引率

0.00%

发文量