Tri-gated poly-Si nanowire SONOS devices

H. Hsu, T. Liu, Chuan-Ding Lin, Chiu Kuo-Jung, Tiao-Yuan Huang, Horng-Chih Lin
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引用次数: 3

Abstract

Si nanowire (NW) SONOS devices have recently been demonstrated as a good candidate for high-density non-volatile memory application [1][2]. Owing to the high surface-to-volume ratio of the NW channel, the programming and erasing (P/E) operation of the device could be performed at a lower voltage and much faster speed over the planar counterpart [2]. However, the fabrication of NW devices typically requires advanced lithographic tools and/or complicated process flow. These are not compatible with the manufacturing of flat-panel products where the device feature size is generally several microns or larger. In this work, we propose a simple and cost-effective approach to integrate planar poly-Si thin-film transistors (TFTs) and tri-gated poly-Si NW SONOS devices without resorting to advanced lithographic tools. Greatly enhanced P/E speed with the use of NW structure is clearly demonstrated.
三门控多晶硅纳米线SONOS器件
硅纳米线(NW) SONOS器件最近被证明是高密度非易失性存储器应用的良好候选器件[1][2]。由于NW通道的高表面体积比,该器件的编程和擦除(P/E)操作可以在比平面对应器件更低的电压和更快的速度下进行[2]。然而,NW器件的制造通常需要先进的光刻工具和/或复杂的工艺流程。这些与平板产品的制造不兼容,因为平板产品的设备特征尺寸通常是几微米或更大。在这项工作中,我们提出了一种简单而经济的方法来集成平面多晶硅薄膜晶体管(tft)和三门控多晶硅NW SONOS器件,而无需借助先进的光刻工具。使用NW结构大大提高了市盈率。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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