Exploiting capacitance in high-performance computer systems

A. Chow, D. Hopkins, R. Drost, R. Ho
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引用次数: 8

Abstract

Aggressive scaling of transistor feature sizes has enabled unprecedented levels of integration and corresponding performance improvements in VLSI systems. However, fabrication costs present barriers to continued growth in transistor density. Proximity Communication breaks these barriers by providing high-density, high-bandwidth, low-power, and scalable off-chip I/O, allowing designers to partition their designs into separate chips with significantly reduced performance penalties. This partitioning greatly improves chip and package yield, and enables modular assemblies of heterogeneous systems with customizable mixes of functional units tailored for specific end-user applications.
在高性能计算机系统中利用电容
晶体管特征尺寸的积极缩放使VLSI系统的集成和相应的性能改进达到了前所未有的水平。然而,制造成本阻碍了晶体管密度的持续增长。邻近通信通过提供高密度、高带宽、低功耗和可扩展的片外I/O打破了这些障碍,允许设计人员将其设计划分为单独的芯片,从而大大降低了性能损失。这种划分极大地提高了芯片和封装的成品率,并支持异构系统的模块化组装,并为特定的最终用户应用程序定制功能单元的可定制组合。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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