An innovative and low cost Bi-layer method for temporary bonding

Abstract

The purpose of this work was to demonstrate the compatibility of Dow Corning's temporary bonding solution with EVG's 850XT universal temporary bonding and debonding platform. The proposed process made use of well-known processing steps and processing modules like spin coating. The process consisted of a release layer (Dow Corning® WL-3001 Bonding Release) and an adhesive layer (Dow Corning® WL-4050 or WL-4030 Bonding Adhesive) using an EVG® 850TB - 300 mm XT frame. Both layers of material were applied by spin coating on the device wafer side. In the frame of this study, silicon carriers were used. Bonding was performed under vacuum at room temperature. A post bonding bake step was applied using a hotplate. After subsequent backside processing steps, the room temperature debonding was performed.