Key hot-carrier degradation model calibration and verification issues for accurate AC circuit-level reliability simulation

Wenjie Jiang, H. Le, S. Dao, S.A. Kim, B. Stine, J. E. Chung, Yu-Jen Wu, P. Bendix, S. Prasad, A. Kapoor, T. Kopley, T. Dungan, I. Manna, P. Marcoux, Lifeng Wu, A. Chen, Zhihong Liu
{"title":"Key hot-carrier degradation model calibration and verification issues for accurate AC circuit-level reliability simulation","authors":"Wenjie Jiang, H. Le, S. Dao, S.A. Kim, B. Stine, J. E. Chung, Yu-Jen Wu, P. Bendix, S. Prasad, A. Kapoor, T. Kopley, T. Dungan, I. Manna, P. Marcoux, Lifeng Wu, A. Chen, Zhihong Liu","doi":"10.1109/RELPHY.1997.584278","DOIUrl":null,"url":null,"abstract":"This study provides necessary degradation model calibration and evaluation guidelines required to enable more consistent and effective use of hot-carrier reliability simulation tools. Benchmark results provide strong verification that the AC degradation models are generally accurate if properly calibrated; however, SPICE modeling errors, secondary physical mechanisms and statistical parameter variation are found to impact the simulated results as much as differences in the circuit design itself.","PeriodicalId":193458,"journal":{"name":"1997 IEEE International Reliability Physics Symposium Proceedings. 35th Annual","volume":"170 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-04-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"16","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1997 IEEE International Reliability Physics Symposium Proceedings. 35th Annual","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RELPHY.1997.584278","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 16

Abstract

This study provides necessary degradation model calibration and evaluation guidelines required to enable more consistent and effective use of hot-carrier reliability simulation tools. Benchmark results provide strong verification that the AC degradation models are generally accurate if properly calibrated; however, SPICE modeling errors, secondary physical mechanisms and statistical parameter variation are found to impact the simulated results as much as differences in the circuit design itself.
关键的热载流子退化模型校准和验证问题,以实现准确的交流电路级可靠性仿真
本研究提供了必要的退化模型校准和评估指南,以实现更一致和有效地使用热载体可靠性仿真工具。基准测试结果有力地证明,如果校准得当,交流退化模型通常是准确的;然而,SPICE建模误差、二次物理机制和统计参数变化对模拟结果的影响与电路设计本身的差异一样大。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信