Thermal management of hotspots using upstream laminar micro-jet impinging array

Yong Han, Yong Jiun Lee, B. L. Lau, Xiaowu Zhang, Y. Leong, K. F. Choo, P. Chan
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引用次数: 8

Abstract

The problem of heat removal is likely to become more severe due to the presence of hotspots in the integrated circuit chip. The heat dissipation capability of the upstream laminar micro-jet impinging array is investigated for hotspot cooling. Micro-jet impingement array cooling is an effective method of using liquids to cool electronics where high convective heat transfer rates are required. Several simulations have been implemented on the thermal structure of 4 tiny inline-aligned hotspots to evaluate the heat dissipation capability of the laminar micro-jet impinging array. The effects of the jet diameter, jet pitch and jet-to-wall distance on the Nusselt number, heat convection coefficient, Reynolds number and thermal resistance are studied. The limit of the dissipated heat fluxes of the considered thermal structure are evaluated for the hotspots of different sizes.
基于上游层流微射流冲击阵列的热点热管理
由于集成电路芯片中存在热点,散热问题可能会变得更加严重。研究了上游层流微射流冲击阵列的热冷却性能。微射流冲击阵列冷却是一种利用液体冷却需要高对流换热率的电子设备的有效方法。为了评价层流微射流冲击阵列的散热性能,对4个微小直列热点的热结构进行了模拟。研究了射流直径、射流节距和射流壁距对努塞尔数、热对流系数、雷诺数和热阻的影响。在不同大小的热点下,计算了所考虑的热结构的散热通量极限。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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