Laser reinforcement of polytetrafluorethylene-metal adhesive joints

European Workshop Materials for Advanced Metallization, Pub Date : 1997-03-16 DOI:10.1109/MAM.1998.887558

N. I. Tishkov, N. Fedosenko, S. Chizhik

{"title":"Laser reinforcement of polytetrafluorethylene-metal adhesive joints","authors":"N. I. Tishkov, N. Fedosenko, S. Chizhik","doi":"10.1109/MAM.1998.887558","DOIUrl":null,"url":null,"abstract":"Summary form only given, as follows. Adhesion between polytetrafluorethylene (PTFE) and metals is rather poor. In this paper an original method for solving the problem of adhesion between PTFE and copper vacuum deposited film is proposed. This method consists of exposing the adhesive joint from the side of the copper film to pulsed laser emission with alternating duration. The attained adhesive strength of the PTFE-copper joint is comparable with cohesive strength of bulk PTFE. The causes of adhesion strengthening of the joint are discussed on the basis of atomic force microscopy (AFM), SEM, and SIMS. It is probable that reinforcement of the PTFE-copper joint after laser treatment results from pulsed heating of the PTFE boundary layer which is interfaced to copper and activation of the adhesive interaction in the presence of oxygen sorbed by metal. It is supposed that this is a necessary condition for reinforcement of the joint. The data obtained deepen our insight on the adhesive interaction in metal-polymer systems under laser treatment. In practice these results might be used for metallic film soldering on polymeric substrates in microelectronics.","PeriodicalId":302609,"journal":{"name":"European Workshop Materials for Advanced Metallization,","volume":"38 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-03-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"European Workshop Materials for Advanced Metallization,","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MAM.1998.887558","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

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Abstract

Summary form only given, as follows. Adhesion between polytetrafluorethylene (PTFE) and metals is rather poor. In this paper an original method for solving the problem of adhesion between PTFE and copper vacuum deposited film is proposed. This method consists of exposing the adhesive joint from the side of the copper film to pulsed laser emission with alternating duration. The attained adhesive strength of the PTFE-copper joint is comparable with cohesive strength of bulk PTFE. The causes of adhesion strengthening of the joint are discussed on the basis of atomic force microscopy (AFM), SEM, and SIMS. It is probable that reinforcement of the PTFE-copper joint after laser treatment results from pulsed heating of the PTFE boundary layer which is interfaced to copper and activation of the adhesive interaction in the presence of oxygen sorbed by metal. It is supposed that this is a necessary condition for reinforcement of the joint. The data obtained deepen our insight on the adhesive interaction in metal-polymer systems under laser treatment. In practice these results might be used for metallic film soldering on polymeric substrates in microelectronics.

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聚四氟乙烯-金属胶粘接接头的激光增强

仅给出摘要形式，如下。聚四氟乙烯(PTFE)与金属之间的附着力较差。本文提出了一种解决真空镀铜膜与聚四氟乙烯粘接问题的新颖方法。该方法是将粘接接头从铜膜的侧面暴露在脉冲激光的交替照射下。得到的聚四氟乙烯-铜接头的粘接强度与块状聚四氟乙烯的粘接强度相当。利用原子力显微镜(AFM)、扫描电子显微镜(SEM)和模拟模态分析(SIMS)分析了接头粘结增强的原因。激光处理后聚四氟乙烯-铜接头的增强可能是由于与铜界面的聚四氟乙烯边界层的脉冲加热和金属吸附氧存在下的粘合相互作用的激活。认为这是加固节点的必要条件。获得的数据加深了我们对激光处理下金属-聚合物体系中粘附相互作用的认识。在实践中，这些结果可用于微电子中聚合物衬底上的金属薄膜焊接。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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European Workshop Materials for Advanced Metallization,

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