Reliability of E/D PHEMT process for control circuit applications

Xinxing Yang, P. Ersland
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引用次数: 2

Abstract

WA-COM has developed an E/D pHEMT process for use in control circuit applications. By adding an E-mode FET to our existing D-mode pHEMT switch process, we are able to integrate logic circuits onto the same die as the RF portion of complex control products (multi-throw switches, multi bit attenuators, etc.). While this capability is not uncommon in the GaAs community, it is new for our fab, and provided new challenges both in processing and in reliability testing. We conducted many tests that focused on the reliability characteristics of this new Emode FET; in the meanwhile, we also needed to assure no degradation of the already qualified D-mode FET. While our initial test suggested low mean-time-tofailure (MTTF) for E-mode devices, recent reliability results have been much better, exceeding our minimum MTTF requirement of 106 hours at channel temperature TCH= 125 °C. Our analysis also shows that devices from this process have high activation energy (Ea 1.6 eV).
用于控制电路应用的E/D PHEMT工艺的可靠性
WA-COM开发了一种用于控制电路应用的E/D pHEMT工艺。通过在现有的d模pHEMT开关工艺中添加e模场效应管,我们能够将逻辑电路集成到与复杂控制产品(多投开关,多位衰减器等)的RF部分相同的芯片上。虽然这种能力在GaAs社区中并不罕见,但对于我们的晶圆厂来说是新的,并且在加工和可靠性测试方面都提出了新的挑战。我们针对这种新型Emode FET的可靠性特性进行了许多测试;同时,我们还需要确保已经合格的d模场效应管没有退化。虽然我们的初始测试表明e模式器件的平均故障时间(MTTF)较低,但最近的可靠性结果要好得多,超过了我们在通道温度TCH= 125°C下106小时的最低MTTF要求。我们的分析还表明,该工艺产生的器件具有较高的活化能(Ea 1.6 eV)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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