Effect of strain rate on tensile properties of miniature size lead-free alloys

2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) Pub Date : 2012-11-01 DOI:10.1109/IEMT.2012.6521839

Y. Toyama, I. Shohji

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引用次数: 2

Abstract

Tensile properties of several lead-free solder were investigated at a strain rate ranging from 2 × 10-3 s-1 to 2 × 102 s-1 at room temperature using micro-size specimens. Five kinds of lead-free solder which are Sn-3mass%Ag-0.5mass%Cu, Sn-0.7mass%Cu, Sn-5mass%Sb, Sn-8.5mass%Sb and Sn-13mass%Sb were prepared. Sn-37mass%Pb solder was also prepared as a comparison. Tensile strength increases with increasing the strain rate and is proportional to the logarithm of the strain rate. In Sn-3Ag-0.5Cu and Sn-37Pb solder, specimens were necked uniformly and dimple fracture mainly occurred. Tensile strength became relatively high in those solder. In Sn-0.7Cu, Sn-5Sb and Sn-8.5Sb solder, specimens were not necked uniformly and chisel point fracture was observed. Tensile strength of such solder became relatively low compared with those of Sn-3Ag-0.5Cu and Sn-37Pb solder. In Sn-13Sb solder, brittle fracture occurred and elongation decreased compared with other solder. For elongation, Sn-5Sb and Sn-8.5Sb solder showed an excellent value of approximately 90% at the maximum strain rate investigated.

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应变速率对微型无铅合金拉伸性能的影响

采用微尺寸试样研究了几种无铅焊料在2 × 10-3 s-1 ~ 2 × 102 s-1应变速率下的室温拉伸性能。制备了Sn-3mass%Ag-0.5mass%Cu、Sn-0.7mass%Cu、Sn-5mass%Sb、Sn-8.5mass%Sb和Sn-13mass%Sb 5种无铅焊料。还制备了Sn-37mass%Pb焊料作为比较。拉伸强度随应变率的增加而增加，并与应变率的对数成正比。在Sn-3Ag-0.5Cu和Sn-37Pb钎料中，试样颈状均匀，以韧窝断裂为主。这些焊料的抗拉强度变得相对较高。在Sn-0.7Cu、Sn-5Sb和Sn-8.5Sb焊料中，试样颈部不均匀，出现凿点断裂。与Sn-3Ag-0.5Cu和Sn-37Pb钎料相比，该钎料的抗拉强度相对较低。Sn-13Sb焊料出现脆性断裂，伸长率下降。对于伸长率，Sn-5Sb和Sn-8.5Sb焊料在最大应变速率下显示出约90%的优异值。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)

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