Simulation Approach to Predict Warpage based on Resin Curing Behavior during Substrate Manufacturing Process

Abstract

Progress in the high-density mounting of electronic equipment warrants a manufacturing technique for suppressing the warpage of the circuit board and an analysis technique for predicting warpage. In this study, we developed a technique to accurately predict the difference in circuit board warpage caused by variations in manufacturing process by simulating resin curing behavior. As a result, the manufacturing process was optimized to reduce mounting failure caused by substrate warpage.