Behavior of Resorcinol based Phthalonitrile as High Temperature Encapsulant

Abstract

The increasing demand of harsh environment applications have propelled the engineering frontier for ruggedized electronics packaging. The need for alternative high temperature materials such as Phthalonitrile-based polymers has been on the rise to substitute the epoxy counterparts which have limited progression for such harsh environment applications. Resorcinol-based phthalonitrile (PN), known for their high thermal stability and good mechanical properties, can be a good candidate. However, investigations of PN as a microelectronics packaging material have not been substantial. Moreover, addition of fillers as well as the different filler types can alter the properties of PN such as its thermal behavior. This study looks into how alumina fillers affect the dielectric property, bulk resistivity and thermal conductivity of PN, which provides an insight of using PN as an encapsulation material for high temperature applications.