Variational interconnect delay metrics for statistical timing analysis

P. Ghanta, S. Vrudhula
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引用次数: 14

Abstract

For statistical timing analysis and physical design optimization, interconnect delay metrics that model the delay as a function of the metal process variations are very important. Accurate linear or at most second order delay models in terms of the process variables are necessary to efficiently propagate uncertainty in the state-of-the-art VLSI designs with millions of transistors and on chip interconnects. In this paper, we develop a method to extend the traditional moment based delay analysis of interconnects to consider the impact of Gaussian metal process variations and obtain mean-square optimal linear delay models for interconnects. We consider linear models for the variations in the conductance and capacitance of interconnects and represent the moments (m0, m1, m2) of the interconnect impulse response as a first order orthogonal polynomial series expansion in the process variables. We obtain the coefficients of the expansion by using the Galerkin residual error minimization method on the recursive equations that relate the interconnect moments (m0, m1 , m2). We compare the accuracy of our approach against SPICE based Monte Carlo simulations and demonstrate a good match
用于统计时序分析的变分互连延迟度量
对于统计时序分析和物理设计优化,将互连延迟作为金属工艺变化的函数建模的互连延迟度量是非常重要的。在具有数百万晶体管和片上互连的最先进的VLSI设计中,精确的线性或最多二阶延迟模型对于有效地传播不确定性是必要的。在本文中,我们发展了一种方法,扩展了传统的基于矩的互连延迟分析,以考虑高斯金属工艺变化的影响,并获得互连的均方最优线性延迟模型。我们考虑了互连体电导和电容变化的线性模型,并将互连体脉冲响应的矩(m0, m1, m2)表示为过程变量中的一阶正交多项式级数展开。我们利用Galerkin残差最小化方法对与互连矩(m0, m1, m2)相关的递推方程求出展开系数。我们将该方法的准确性与基于SPICE的蒙特卡罗模拟进行了比较,并证明了良好的匹配
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