A high-performance global eletromagnetic noise suppression method for 3D TSV SiP

Abstract

In this paper, we propose a high-performance method to suppress global electromagnetic noise coupling in 3D through silicon via (TSV) system in package (SiP). This technique needs to form a periodic shielding structure in 3D SiP, which consists of contact arrays, grid ground planes and ground TSV array. Contact arrays and grid ground planes can suppress noise coupling in the shallow substrate and ground TSV array suppresses noise coupling in the deep substrate. This method is practical for noise suppression in 3D SiP with heterogeneous integration. Results show that it has a better performance when it is compared to the guard ring method even the working frequency reaches 50 GHz.