Yield improvement by local wiring redundancy

J. Bickford, J. Hibbeler, Markus Bühler, J. Koehl, D. Müller, Sven Peyer, C. Schulte
{"title":"Yield improvement by local wiring redundancy","authors":"J. Bickford, J. Hibbeler, Markus Bühler, J. Koehl, D. Müller, Sven Peyer, C. Schulte","doi":"10.1109/ISQED.2006.148","DOIUrl":null,"url":null,"abstract":"Technology migration from 130 nm to 90 nm has resulted in increased yield loss caused by opens in wiring interconnects and vias. Sensitivity to these defects can be significantly reduced through the use of design methodologies that use arbitrary networks with high degrees of redundancy instead of trees for signal wires. In this paper we describe a technique that improves yield by adding via redundancy through the use of local loops. The commonly used practice of inserting a second via adjacent to an existing via can only be applied to a limited number of vias, generates wrong-way wiring, and does not significantly reduce critical area because of the proximity of the two vias. Industry examples are cited to show that use of local loops to create redundancy reduces critical area, does not require wrong-way wiring, and achieves a higher percent of redundant vias. Addition of local loops does not impact timing or wireability of the design","PeriodicalId":138839,"journal":{"name":"7th International Symposium on Quality Electronic Design (ISQED'06)","volume":"52 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"21","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"7th International Symposium on Quality Electronic Design (ISQED'06)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISQED.2006.148","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 21

Abstract

Technology migration from 130 nm to 90 nm has resulted in increased yield loss caused by opens in wiring interconnects and vias. Sensitivity to these defects can be significantly reduced through the use of design methodologies that use arbitrary networks with high degrees of redundancy instead of trees for signal wires. In this paper we describe a technique that improves yield by adding via redundancy through the use of local loops. The commonly used practice of inserting a second via adjacent to an existing via can only be applied to a limited number of vias, generates wrong-way wiring, and does not significantly reduce critical area because of the proximity of the two vias. Industry examples are cited to show that use of local loops to create redundancy reduces critical area, does not require wrong-way wiring, and achieves a higher percent of redundant vias. Addition of local loops does not impact timing or wireability of the design
通过本地布线冗余来提高产量
从130纳米到90纳米的技术迁移导致了由于布线互连和过孔打开而导致的产量损失增加。通过使用具有高度冗余度的任意网络而不是信号线树的设计方法,可以显着降低对这些缺陷的敏感性。在本文中,我们描述了一种通过使用局部环路增加冗余来提高良率的技术。通常使用的在现有过孔附近插入第二个过孔的做法只能应用于有限数量的过孔,会产生错误的布线,并且由于两个过孔的靠近而不能显着减少临界面积。引用的行业示例表明,使用本地环路创建冗余减少了关键区域,不需要错误的布线,并实现了更高百分比的冗余过孔。本地环路的增加不会影响设计的时序或可连接性
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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