Yuyang Wang, Leilai Shao, M. Lastras-Montaño, K. Cheng
{"title":"Taming Emerging Devices' Variation and Reliability Challenges with Architectural and System Solutions [Invited]","authors":"Yuyang Wang, Leilai Shao, M. Lastras-Montaño, K. Cheng","doi":"10.1109/ICMTS.2019.8730924","DOIUrl":null,"url":null,"abstract":"Emerging devices are promising alternatives to traditional CMOS technologies as proposed in various solutions for future computation and communication systems. However, such devices often suffer from significant variations and relatively poor reliability. To address such limitations for their broader adoption, novel techniques at circuit, architecture, and system levels could help alleviate the device variation and reliability challenges. In this paper, we illustrate the effectiveness of such techniques in three distinct application domains, namely nonvolatile memories, flexible electronics, and silicon photonics-enabled optical interconnects.","PeriodicalId":333915,"journal":{"name":"2019 IEEE 32nd International Conference on Microelectronic Test Structures (ICMTS)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 32nd International Conference on Microelectronic Test Structures (ICMTS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMTS.2019.8730924","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
Emerging devices are promising alternatives to traditional CMOS technologies as proposed in various solutions for future computation and communication systems. However, such devices often suffer from significant variations and relatively poor reliability. To address such limitations for their broader adoption, novel techniques at circuit, architecture, and system levels could help alleviate the device variation and reliability challenges. In this paper, we illustrate the effectiveness of such techniques in three distinct application domains, namely nonvolatile memories, flexible electronics, and silicon photonics-enabled optical interconnects.