Bare die test

Abstract

The author describes a bare die test approach that uses a temporary interconnect technique overlaid on a reconstructed pseudo-wafer of individual bare dice. This overlay technique maps design-specific pad locations to a standard grid that can be tested with a universal membrane probe. The proposed approach allows the development cost of a thin-film membrane probe to be shared across many die types, thus reducing the cost and complexity of tooling new die types. An experiment performed to validate this approach is described.<>