Configurable sintered interconnect (CSI) DAP-less QFN package for high thermal performance application

Abstract

Smart phones and mobile devices are one of the key drivers of Internet of Things (IOT). Requirements of better power dissipation, higher electrical performance and low cost continue to drive innovation and new technologies in packaging. Using innovative additive manufacturing technology, EoPlex has developed a new type of QFN package that does not use any etched processes for manufacturing. It addresses improvements in electrical performance for single layer packages, with better power dissipation and lower cost than existing solutions.