Adhesion requirements for photovoltaic modules of polymeric encapsulation

Jiang Zhu, Gabriel Surier, Dan Wu, Daniel Montiel-Chicharro, T. Betts, R. Gottschalg
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引用次数: 3

Abstract

Adhesion requirements for PV are often discussed but a detailed quantification based on scientific principles is outstanding. A test for the realistic assessment of requirements is presented. The difference between this test and the conventional peel test is that the test is conducted in-situ during ageing experiments in the climatic cabinet at realistic operating temperatures. Weights are attached to the backsheet of tested PV mini-modules to test stability of adhesion as devices being aged. This test is designed to identify the weakest interface of the multilayer encapsulation system and investigate the difference between field tests and failures (not) observed in certification testing. A series of samples was prepared under a wide range of lamination conditions. Different failure modes and ageing characteristics were observed. Some samples suffered quick failure of the adhesive bonds in the encapsulation system while others withstood forces of 20g/cm for 1000 hours. The test allows a clear discrimination between different samples and links closely to operational requirements.
聚合物封装光伏组件的附着力要求
PV的附着力要求经常被讨论,但基于科学原理的详细量化是突出的。提出了一种实际评估需求的测试方法。该试验与传统剥离试验的不同之处在于,该试验是在实际操作温度下在气候柜中进行老化试验的现场进行的。砝码被附加到被测试的PV迷你模块的背板上,以测试设备老化时粘附的稳定性。该测试旨在识别多层封装系统中最薄弱的接口,并调查现场测试与认证测试中观察到的故障(未)之间的差异。在各种层压条件下制备了一系列样品。观察到不同的失效模式和老化特征。一些样品在封装系统中粘结很快失效,而另一些样品承受20g/cm的力1000小时。该测试允许在不同样品之间进行明确区分,并与操作要求密切相关。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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