{"title":"A design and production framework for modular microsystems","authors":"V. Grosser, M. Schuenemann, B. Michel, H. Reichl","doi":"10.1109/MHS.1999.820005","DOIUrl":null,"url":null,"abstract":"The trend to higher integration in microelectronics and the integration of micromechanical, microfluidic and microoptical components require new packaging solutions. A highly flexible design and production framework for microsystems, suitable for mid-scale production at reasonable costs, was developed.","PeriodicalId":423453,"journal":{"name":"MHS'99. Proceedings of 1999 International Symposium on Micromechatronics and Human Science (Cat. No.99TH8478)","volume":"94 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-11-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"MHS'99. Proceedings of 1999 International Symposium on Micromechatronics and Human Science (Cat. No.99TH8478)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MHS.1999.820005","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
The trend to higher integration in microelectronics and the integration of micromechanical, microfluidic and microoptical components require new packaging solutions. A highly flexible design and production framework for microsystems, suitable for mid-scale production at reasonable costs, was developed.