A design and production framework for modular microsystems

V. Grosser, M. Schuenemann, B. Michel, H. Reichl
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引用次数: 2

Abstract

The trend to higher integration in microelectronics and the integration of micromechanical, microfluidic and microoptical components require new packaging solutions. A highly flexible design and production framework for microsystems, suitable for mid-scale production at reasonable costs, was developed.
模块化微系统的设计和生产框架
微电子技术和微机械、微流体和微光学元件集成的趋势要求新的封装解决方案。开发了一种高度灵活的微系统设计和生产框架,适用于中等规模的生产,成本合理。
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