Addressing High Speed Memory Interface Test Quality Gaps in Shared Bus Architecture

Wilson Pradeep, R. Gottumukkala, S. Vooka
{"title":"Addressing High Speed Memory Interface Test Quality Gaps in Shared Bus Architecture","authors":"Wilson Pradeep, R. Gottumukkala, S. Vooka","doi":"10.1109/ITCIndia52672.2021.9533002","DOIUrl":null,"url":null,"abstract":"Recent trends in high performance SoCs (System-on-Chips) indicate a significant growth in memory content causing memory paths to be amongst the most critical paths in the designs. Hence, high quality memory interface tests are crucial in achieving low DPPM (defective parts per million) and better screening of parts. Shared bus interface is a typical memory architecture used in complex processor cores to enable memory testing along its true functional access path. In spite of that, certain gaps exist which limits covering all functional interfaces to memories in its entirety. In this paper, we propose a novel methodology to strategically identify specific high speed memory interfaces with test quality gaps and tactically target them through structural scan based tests along the longest path to enable screen for marginal defects. The proposed method deploys a composite slack based test method to achieve high test quality at a minimal test cost impact. Experimental results on a large design indicate significant reduction (67%) in the target fault set, which resulted in 65% reduction in test vectors (71% test time reduction) using the proposed schemes as compared to baseline methods used for structural memory sequential test.","PeriodicalId":177825,"journal":{"name":"2021 IEEE International Test Conference India (ITC India)","volume":"109 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-07-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE International Test Conference India (ITC India)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITCIndia52672.2021.9533002","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

Recent trends in high performance SoCs (System-on-Chips) indicate a significant growth in memory content causing memory paths to be amongst the most critical paths in the designs. Hence, high quality memory interface tests are crucial in achieving low DPPM (defective parts per million) and better screening of parts. Shared bus interface is a typical memory architecture used in complex processor cores to enable memory testing along its true functional access path. In spite of that, certain gaps exist which limits covering all functional interfaces to memories in its entirety. In this paper, we propose a novel methodology to strategically identify specific high speed memory interfaces with test quality gaps and tactically target them through structural scan based tests along the longest path to enable screen for marginal defects. The proposed method deploys a composite slack based test method to achieve high test quality at a minimal test cost impact. Experimental results on a large design indicate significant reduction (67%) in the target fault set, which resulted in 65% reduction in test vectors (71% test time reduction) using the proposed schemes as compared to baseline methods used for structural memory sequential test.
解决共享总线架构中高速存储器接口测试质量差距的问题
高性能soc(片上系统)的最新趋势表明存储器内容显着增长,导致存储器路径成为设计中最关键的路径之一。因此,高质量的存储器接口测试对于实现低DPPM(百万分率缺陷)和更好地筛选部件至关重要。共享总线接口是一种典型的内存架构,用于复杂的处理器内核,使内存测试沿着其真正的功能访问路径。尽管如此,某些差距仍然存在,这限制了将所有功能接口完整地覆盖到存储器。在本文中,我们提出了一种新的方法来战略性地识别具有测试质量差距的特定高速存储接口,并通过沿着最长路径的基于结构扫描的测试来策略性地定位它们,以启用边缘缺陷的筛选。该方法采用基于复合松弛的测试方法,以最小的测试成本影响实现高测试质量。大型设计的实验结果表明,与结构记忆顺序测试的基准方法相比,使用所提出的方案,目标故障集显著减少(67%),测试向量减少65%(测试时间减少71%)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信