Recent advances of RTN technique towards the understanding of the gate dielectric reliability in trigate FinFETs

S. Chung
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引用次数: 2

Abstract

The experimental RTN-trap profiling method bas been demonstrated on both planar and trigate MOSFETs. It was achieved by a simple experimental method to take the 2D profiling of the RTN-trap in both oxide depth (vertical) and channel (lateral) directions in the gate oxide. Then, by arranging various 2D fields for the device stress condition, the positions of RTN traps can be precisely controlled. The positions of RTN-traps can be manipulated, showing significant advances for the understanding of the trap generation and the impact on the device reliability. Results have demonstrated why trigate exhibits much worse reliability than the planar ones.
RTN技术在理解三栅极finfet栅极介电可靠性方面的最新进展
在平面型和三极管型mosfet上均进行了rtn -陷阱分析实验。通过一种简单的实验方法,在栅极氧化物的氧化深度(垂直)和沟道(横向)方向上获得了rtn -陷阱的二维轮廓。然后,通过为器件应力条件安排各种二维场,可以精确控制RTN陷阱的位置。rtn -trap的位置可以被操纵,显示出对trap产生和对设备可靠性影响的理解的重大进步。结果表明,三角结构的可靠性远低于平面结构。
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