High performance Cu interconnects with low-k BCB-polymers by plasma-enhanced monomer-vapor polymerization (PE-MVP) method

Abstract

A new plasma-enhanced organic monomer-vapor polymerization (PE-MVP) method is developed for deposition of divinyl siloxane bis-benzocyclobutene (DVS-BCB) polymer films with low dielectric constant, k=2.7. The PE-MVP method eliminates polymer oxidation of DVS-BCB during polymerization, improving the thermal stability. By combining the MOCVD-Cu technique with the PE-MVP, narrow-pitch Cu/BCB damascene lines reveal a 35% reduction in the line capacitance compared to Cu/SiO/sub 2/ lines, while the interline leakage current is kept as low as 5/spl times/10/sup -9/ A/cm/sup 2/.