Z. Tokei, I. Ciofi, P. Roussel, P. Debacker, P. Raghavan, M. H. van der Veen, N. Jourdan, C. Wilson, V. V. Gonzalez, C. Adelmann, L. Wen, K. Croes, O. V. P. K. Moors, M. Krishtab, S. Armini, J. Bommels
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引用次数: 14
Abstract
Interconnects pose increasing challenges as technology scaling proceeds. In order to overcome these challenges simultaneous optimization of novel metallization schemes, new materials, circuit and system level approaches are required.
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