{"title":"PATCHWORK smart power thick-film hybrids for automotive under hood applications","authors":"P.K. Wilczek","doi":"10.1109/IEMT.2002.1032719","DOIUrl":null,"url":null,"abstract":"PATCHWORK provides a high degree of integration combining logic and power on one ceramic substrate to respond to customer-specific circuits with acceptable engineering costs and short periods of development. The hybrids are reliable and high-temperature resistant and can be manufactured at a fair market price. The introduction of PATCHWORK combines Ag/Pd/Pt, copper and gold conductors, high temperature solder, window framing design and efficient thermal properties. With these advances in thick film technology many high volume opportunities are open in automotive applications.","PeriodicalId":340284,"journal":{"name":"27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.2002.1032719","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
PATCHWORK provides a high degree of integration combining logic and power on one ceramic substrate to respond to customer-specific circuits with acceptable engineering costs and short periods of development. The hybrids are reliable and high-temperature resistant and can be manufactured at a fair market price. The introduction of PATCHWORK combines Ag/Pd/Pt, copper and gold conductors, high temperature solder, window framing design and efficient thermal properties. With these advances in thick film technology many high volume opportunities are open in automotive applications.