IGBT collector-emitter failure mechanism

S. S. Lee, W. Tham, C. K. Ang
{"title":"IGBT collector-emitter failure mechanism","authors":"S. S. Lee, W. Tham, C. K. Ang","doi":"10.1109/IPFA.2016.7564276","DOIUrl":null,"url":null,"abstract":"Collector-Emitter breakdown voltage failure of IGBT can be caused by leakage characteristic or solely reverse blocking voltage issue. The involvement of potential defect could be located near the front side, where the main transistor construction located (the top side), chip temination edge and down to the backside where the fieldstop layer takes place. This paper basically outlined the failure mechanisms based on the Current-Voltage characteristic and they were then visualized through the physical analyses, and they were proven from the failure analyses findings.","PeriodicalId":206237,"journal":{"name":"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-07-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2016.7564276","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

Collector-Emitter breakdown voltage failure of IGBT can be caused by leakage characteristic or solely reverse blocking voltage issue. The involvement of potential defect could be located near the front side, where the main transistor construction located (the top side), chip temination edge and down to the backside where the fieldstop layer takes place. This paper basically outlined the failure mechanisms based on the Current-Voltage characteristic and they were then visualized through the physical analyses, and they were proven from the failure analyses findings.
IGBT集电极-发射极失效机制
IGBT的集电极-发射极击穿电压失效可能是由漏电特性引起的,也可能是单纯的反向阻断电压问题引起的。潜在缺陷的参与可能位于靠近前端,即主晶体管结构所在的位置(顶部),芯片终端边缘和发生场阻挡层的背面。本文基本概述了基于电流-电压特性的失效机理,通过物理分析将其可视化,并从失效分析结果中对其进行验证。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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