Enabling thin packages with embeded components: A market arrives

Abstract

As companies realize that alternatives to 3D TSV die stacks are needed for commercial products, many companies are moving into production with embedded components in IC package substrates. The use of embedded die enables the production of a thin package that meets critical requirements of mobile products. Embedded components are found in many different configurations. Package-on-package is one of the latest package types to make use of embedded components. Some companies will embed active components in the substrate using a lamination process while others have adopted different manufacturing methods. Embedded actives are just one example of production packages, and there are applications that also use embedded formed resistors or capacitors, while others embed discrete passive components. This presentation examines the drivers for today's embedded component applications and how today's developments differ from technology introduced in the past.