Fuse Resistor Consisting of a Metallic Thin Film and a Polymerized Organic Film on a Substrate

Abstract

A new type of fuse resistor has been made by the following method. A polymerized organic film is formed on a substtate by the plasma polymerization method. Then a Ni-Cr thin film is deposited by vacuum evaporation to form a crossover pattern. Resistors have been fabricated in the range 0.47-10 000 \Omega , ¼ W, which exhibit uniform characteristics with respect to opening time. Fusing action occurs at relatively low temperatures by thermally induced changes in the organic film. This paper describes the opening characteristics as well as the normal resistor properties.