Continuity assessment for supercritical-fluids-deposited (SCFD) Cu film as electroplating seed layer

Abstract

We evaluated supercritical fluid deposition (SCFD) copper thin films compatibility as a seed layer of electroplating processes. SCFD is an attractive technology for conformal metal coating on walls of high-aspect-ratio micro / nano structures (HARMS / HARNS), including trenches and holes. Therefore, it has a great potential for an electroplating seed layer. To utilize SCFD films as seed layers, we assessed the electrical and topological continuity of the SCFD films. The electrical measurements efficiently identified the suitability of various SCFD films for the electroplating process, which could not be achieved by microscope observation. The results have been cross-validated by atomic force microscopy.