Efficient transient full-wave analysis of high-speed interconnects in multilayer PCBs

Abstract

A new approach to efficiently simulate 3-D high-speed multilayer printed circuit boards (PCBs) using the finite-element time-domain (FETD) method is proposed. The method is based on the discretization of these structures using multiple layers of prism finite elements. In order to eliminate coupling between different layers in the mass matrix, a combined exact/approximate numerical integration technique is applied to the finite element matrices. This makes the final mass matrix fully block-diagonal and greatly reduces the inversion/factorization cost and time. The formulation is readily extended to lossy materials without any additional adverse effect on the stability condition.