Comprehensive Study on the Encapsulation for the Intelligent Power Module

Abstract

With the increasing demand of compact and high power rated power module in the EV / HEV (Electric Vehicle / Hybrid Electric Vehicle) industry, packaging of power module is getting more challenging. The push for intelligent power modules in the dynamic markets has led to continuous innovations and material enhancements, as well a lot of R&D investment. Devices which are able to work in the higher temperature and switching at a higher frequency are required [1]–[3]. In this paper, we evaluated six types of molding compound to study their effects of small gaps filling capability and package warpage during the assembly process. In summary, we are able to achieve a relatively low warpage on the molded module for this WLP fabrication method.