Current technology barriers and future direction for packaging

Abstract

Two decades have passed since the introduction of packaging technology with underfill reinforced flip chip bonding and organic chip carrier. The high performance and low cost packaging technology has been facing serious barriers for moving to the next generation. What should be the ranges of joint and wiring ground rules to shoot for the next step? What are the issues for moving to the step and does any solution exists for each issues? How to resolve the barrier for the cost? What is the area to contribute to the environmental issues after Pb free solder? Current status of such questions and direction for the future will be discussed.