System Integration Technology Based on 3D Integration

2022 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK) Pub Date : 2022-11-28 DOI:10.1109/IMFEDK56875.2022.9975417

M. Koyanagi

引用次数: 0

Abstract

A heterogeneous 3D system integration technology is the key technology to achieve future high-performance and energy efficient systems such as high-performance computer system, AI system, post 5G/6G system and quantum computing system. Current status and future prospect of heterogeneous 3D system integration technology are discussed.

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基于三维集成的系统集成技术

异构3D系统集成技术是实现高性能计算机系统、人工智能系统、后5G/6G系统、量子计算系统等未来高性能节能系统的关键技术。讨论了异构三维系统集成技术的现状及未来发展前景。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2022 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK)

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