The effects of floating body operation on hot carrier behavior in SOS MOSFETs

E. Y. Chao, D. Quon, T. Her, G. Li, J. White, P. Liu, R. Kjar
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Abstract

Hot carrier effects in MOSFETs have been intensively investigated in both bulk silicon and SOI materials. However, there is a lack of hot carrier information in SOS MOSFETs. SOS material differs from bulk material in that electron mobility is lower while hole mobility remains unchanged. Reduced mobility is not observed for holes because the mechanical strain in the epitaxial layer due to lattice mismatch between sapphire and silicon lifts the degenerate valence band significantly to make SOSFETs light hole devices. Since hot hole injection into the oxide is commonly observed in devices biased at low gate voltages, it is of great interest to study the contributions of light hole injection to device degradation mechanisms in both floating and non-floating body operation conditions. In this work, we will investigate the behavior of light holes at the oxide interface, and examine the effects of light hole injection under floating body operation on device degradation.<>
浮体操作对SOS mosfet热载流子行为的影响
mosfet中的热载子效应已经在体硅和SOI材料中得到了深入的研究。然而,SOS mosfet缺乏热载流子信息。SOS材料与体块材料的不同之处在于电子迁移率较低,而空穴迁移率不变。由于蓝宝石和硅之间的晶格不匹配导致外延层中的机械应变显著提升了简并价带,从而使sosfet轻孔器件,因此没有观察到孔的迁移率降低。由于在低栅极电压偏置的器件中经常观察到氧化物的热孔注入,因此研究光孔注入对浮体和非浮体运行条件下器件退化机制的贡献具有重要意义。在这项工作中,我们将研究氧化物界面上光孔的行为,并研究浮体操作下光孔注入对器件退化的影响
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