On-die instrumentation to solve challenges for 28nm, 28Gbps timing variability and stressing

W. Ding, M. Pan, W. Wong, Daniel Chow, Mike P. Li, Sergey Shumarayev
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Abstract

Moving to the latest submicron node is required for digital scaling but causes many challenges for analog design. Additionally, scaling pushes the need for higher bandwidth. Data rates up to 28Gbps require effectively dealing with random variations and layout dependent effects. On-die instrumentation (ODI) is an effective means to alleviate many of the challenges, as well as characterize and margin performance. This paper covers two of the ODI techniques used in the design of a wide range 28nm, 28Gbps transceiver.
芯片上的仪器解决28nm、28Gbps时序变化和压力的挑战
移动到最新的亚微米节点是数字缩放所必需的,但这给模拟设计带来了许多挑战。此外,可伸缩性推动了对更高带宽的需求。高达28Gbps的数据速率需要有效地处理随机变化和布局依赖效应。片内仪表(ODI)是一种有效的手段,以减轻许多挑战,以及表征和利润性能。本文介绍了用于设计宽范围28nm, 28Gbps收发器的两种ODI技术。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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