An overview of reliability testing challenges in integrated power amplifier modules for wireless applications

Abstract

When compound semiconductors first emerged in the communications market, they were marketed in the form of single die that were assembled in industry standard packages. Although the semiconductor materials were new, the reliability tests used to evaluate them were proven, time-tested standards adopted from the silicon industry. As the wireless industry continues to evolve, consumer electronics manufacturers have demanded more integration from their wireless component suppliers. Second and third generation wireless components now integrate features that would have historically required multiple physical components on the application board. The net result of this trend is a simplification of design for consumer end-product designers and a complication of design for component suppliers. In addition, the implications for reliability testing have proven significant. Present generation power amplifier modules contain as many as five semiconductor die from different fabrication processes, multiple passive surface mount devices, and an elaborate package substrate to connect all of the components together. This paper will discuss how industry trends in RF components have forced new approaches in component reliability testing. Reliability standards may also need to evolve to address the issues created by new RF integrated modules.