Merged technology on MEMS

M.M.-O. Lee
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引用次数: 4

Abstract

This study presents briefly the review for stress analyses for finding permissible diaphragm dimension by output sensitivity, and piezoresistive sensor theory from SOI (Silicon On Insulator) structures. This paper mainly presents the trends on current smart sensor for future MEMS chip and also demonstrates a way of integrating with calibration, gain stage and microcontroller unit plus high current/high voltage CMOS drivers onto three chip module, two chip module and monolithic chip for future automobile, industrial and medical MEMS products.
MEMS上的融合技术
本文简要介绍了利用输出灵敏度和压阻式传感器理论对SOI(绝缘体上硅)结构进行应力分析以确定允许膜片尺寸的研究进展。本文主要介绍了未来MEMS芯片中智能传感器的发展趋势,并介绍了一种将校准、增益级和微控制器单元以及大电流/高压CMOS驱动器集成到未来汽车、工业和医疗MEMS产品的三片模块、两片模块和单片芯片上的方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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